Heat Dissipating Object with Self Sealing Plug Allowing for a Thermal Interface Material with Fluidity for an Electronic Device

ABSTRACT

The disclosure describes a heat-dissipating object allowing for a liquid metal TIM to transfer heat from an electronic device, comprising: a base plate, a storage-tube with a self-sealing plug structure, one or more additional self-sealing plug structures at the base plate, and a sealing ring, wherein the sealing ring is for providing a sealed gap, and the self-sealing plug structures are for filling a liquid metal into the sealed gap and a portion of the storage tube, and then sealing the liquid in them. A heat sink as a heat-dissipating object and a flip chip package as an electronic device are particularly described in details, and a method for filling a liquid into the sealed gap and a portion of the storage tube of the electronic device is also described.

TECHNICAL FIELD OF THE DISCLOSURE

The disclosure relates generally to a heat-dissipating object fordissipating heat from an electronic device, and particularly to a heatsink for a flip chip package to use a thermal interface material (TIM)with fluidity at least at an operation temperature of the electronicdevice.

BACKGROUND OF THE DISCLOSURE

In a flip chip package with a semiconductor chip being a heat-generatingobject, a thermal interface material (TIM) is usually used to fill thegap between the flip chip and a heat-dissipating object such as a lid ora heat sink for transferring the heat from one to the other. The typesof TIM basically include thermal pad, thermal grease, phase changematerial, and liquid metal. A good TIM needs to have 1) a high thermalconductivity, 2) a good surface wetting capability for reducing thethermal contact resistance, 3) a good gap filling capability, and 4) agood thermal reliability in test or application. A liquid metal as TIMusually includes gallium and gallium alloy. The melting point of galliumis about 29° C., and that of gallium alloy is even lower. The thermalconductivity of liquid metal is much higher than that of the extensivelyused thermal pad or thermal grease. Furthermore, liquid metal has muchbetter capability for surface wetting and gap filling. So, of all thetypes of TIM, liquid metal is an ideal TIM based on these first threeitems. If a liquid metal can be used in a lidded flip chip package, thetemperature of the lidded flip chip package can be reduced significantlyas compared to other types of TIM. However, the conventional lidded flipchip packages based on a conventional lid of prior arts are limited intheir use of liquid metal as its TIM due to the pumping-out issue; thatis, when the package is under a thermal cycling test or in its long termof application, the volume of the gap between the flip chip and the lidvaries with temperature due to the warpage of the flip chip, causing theliquid metal TIM to be pumped out. The TIM pumping-out issue will causean incomplete gap filling between the flip chip and the lid, reducingthe thermal performance of TIM. And the more important thing is thatbecause a liquid metal is electrically conductive, a small amount of TIMpumping-out may damage the whole electronic device. As a result, aliquid metal type of TIM has not been commercially used in a lidded flipchip package. In general, because of similar reasons, a liquid metaltype of TIM is also rarely interposed between heat-dissipating objects(a heat sink, for example) and heat-generating objects (a semiconductorchip, for example) in an electronic device.

For overcoming the liquid TIM pumping-out issue for an electronicdevice, a heat dissipating object coupled with a storage-tube and one ormore air-vent tubes has been disclosed to allow for a liquid thermalinterface material to efficiently transfer heat from a flip chip packageof the prior art, U.S. Ser. No. 11/177,193 B2. However, this heatdissipating object has three disadvantages in its test and application.The first disadvantage is that the preferred liquid metal TIM, includinggallium or its alloys, may get oxidized if it is exposed to oxygen for along time, which is inevitable since the storage-tube is open to theambient at all times. The oxidation may accumulate with time and affectthe flow of the liquid metal to and from the storage-tube. The seconddisadvantage is that when the storage-tube is in an upside downorientation, the liquid metal may leak out and air may be trapped in thesealed gap between the heat dissipating object and the flip chippackage. Finally, the third disadvantage is that even though multipleair-vent tubes are recommended, some air may remain in the sealed gapwhen filling a liquid metal into the sealed gap from the storage-tube.To eliminate these disadvantages, a heat dissipating object coupled withtwo self-sealing plug structures is described in the present disclosure.

SUMMARY OF THE DISCLOSURE

A heat-dissipating object allowing for a thermal interface material(TIM) with fluidity to transfer heat from an electronic device,comprising: a base plate having a top surface and a bottom surface andone or more self-sealing plug structures, a sealing ring, aliquid-storage tube integrated with a self-sealing plug structure,wherein the sealing ring is mounted at the bottom surface of the baseplate, directly sealing a peripheral region at a top surface of theelectronic device to provide a sealed gap between a portion of thebottom surface of the base plate and a portion of the top surface of theelectronic device; wherein each self-sealing plug structure includes achamber with a self-sealing block mounted inside; wherein theliquid-storage tube has two ends, one end is connected to the sealed gapthrough a connecting hole, and another end is integrated with theself-sealing plug structures; wherein the one or more self-sealing plugstructures of the base plate are positioned at the top surface of thebase plate and connected to the sealed gap through one or moreconnecting holes; and wherein the sealed gap is entirely filled with athermal interface material with fluidity, a portion of theliquid-storage tube is filled with the same thermal interface material,and the remaining portion of the liquid-storage tube is filled with agas.

The heat-dissipating object from Paragraph 4, wherein the thermalinterface material with fluidity is formed by a method, which mainlycomprises the following steps:

-   -   1) Mount the heat dissipating object onto the electronic device;    -   2) Insert a needle of a vacuum pump tool through the        self-sealing plug structure integrated with the liquid-storage        tube, and insert a needle of a liquid dispenser through the        self-sealing plug structure integrated with the base plate;    -   3) Pump out the air in the space between the heat-dissipating        object and the electronic device, including that in the sealed        gap and the liquid-storage tube, by switching the vacuum pump        tool to its vacuum condition;    -   4) Inject the thermal interface material with fluidity into the        sealed gap and a portion of the storage tunnel using liquid        dispenser, and then remove the needle of the liquid dispenser;    -   5) Fill a gas into the remaining portion of the storage tunnel        by switching the vacuum pump tool to its gas filling condition,        and then remove the needle of the vacuum pump tool.

The features and advantages of the embodiments of the present disclosurewill become more apparent from the detailed descriptions in conjunctionwith the drawings below. The drawings and associated descriptions are toillustrate the embodiments of the present disclosure, not to limit thescope of what is claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 FIG. 1A and FIG. 1B are schematic diagrams for illustrating aheat dissipating object with a storage-tube as a reservoir and twoself-sealing plug structures for dissipating heat from an electronicdevice via a liquid metal TIM of one preferred embodiment of the presentinvention.

FIG. 10 , FIG. 1D and FIG. 1E are schematic diagrams for furtherillustrating a self-sealing plug structure.

FIG. 2 to FIG. 10 are schematic diagrams for illustrating a method toform a heat dissipating object allowing for a liquid metal TIM totransfer heat from an electronic device of another preferred embodimentof the present invention.

FIG. 11 is a schematic diagram for illustrating that the electronicdevice is particularly a flip chip package of one preferred embodimentof the present invention.

FIG. 12 is a schematic diagram for illustrating another design for thesealing ring for the case that the electronic device is particularly aflip chip package of one embodiment of the present invention.

FIG. 13 is a schematic diagram for illustrating that the electronicdevice is particularly a lidded flip chip package of another preferredembodiment of the present invention.

FIG. 14 is a schematic diagram for illustrating a heat sink allowing fora liquid metal TIM to dissipate heat from a lidded flip chip package ofone preferred embodiment of the present invention.

FIG. 15 is a schematic diagram for illustrating a heat dissipatingobject coupled with a folding-form of storage-tube of another preferredembodiment of the present invention.

FIG. 16 is a schematic diagram for illustrating a heat dissipatingobject coupled with a storage-tube with a self-sealing plug structureand a plurality of self-sealing plug structures for venting air ofanother preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 is a schematic diagram for illustrating a heat dissipating objectwith a storage-tube as a reservoir, a sealing ring, and two self-sealingplug structures, which provides a liquid metal TIM to efficientlydissipate heat from an electronic device of one preferred embodiment ofthe present invention. The numerical symbol 1000 in FIG. 1 designates aheat dissipating object 100 dissipating heat from an electronic device300 via a liquid metal TIM 130 a, in which the numerical symbols 100 and300 respectively designate a heat dissipating object and an electronicdevice, the 101 designates a base plate having a top surface 101 a and abottom surface 101 b of the heat dissipating object 100, the 107designates a sealing ring, which is mounted at the bottom surface 101 b,directly sealing a peripheral region at a top surface of the electronicdevice 300 so as to provide a sealed gap 130 between a portion of thebottom surface 101 b of the base plate 101 and a portion of the topsurface of the electronic device 300, the 130 a designates a liquidmetal TIM in the sealed gap 130, the 102 and 103 designate twoself-sealing plug structures, the self-sealing plug structure 102 ismounted at a top surface 101 a of the base plate 101 a and connected tothe sealed gap 130 through a connecting hole 105, the 104 designates aliquid-storage tube with two ends, one end called inner end is connectedto the sealed gap 130 through a connecting hole 106, another end calledouter end is coupled with the self-sealing plug structure 103, the 104 adesignates a liquid metal filled in a portion of the liquid-storage tube104, and the 104 b designates a gas filled in a remaining portion of theliquid-storage tube 104.

FIG. 1A and FIG. 1B are schematic diagrams for further illustrating theheat dissipating object from its top and bottom views. The numericalsymbol 1100 in FIG. 1A designates a bottom view of the heat dissipatingobject 100 as shown in FIG. 1 , in which the same numerical symbols 101,105, 106 and 107 as those in FIG. 1 are used to designate the sameelements from their bottom view. The numerical symbol 1200 in FIG. 1Bdesignates a top view of the heat dissipating object 100 as shown inFIG. 1 , in which the same numerical symbols 101, 102 and 103 as thosein FIG. 1 are used to designate the same elements from their top view.It is noted that the two self-sealing plug structures only occupy asmall portion at the top surface of the base plate 101 of the heatdissipating object 100. So, it is seen that the arrangement of someother elements, like fins for a heat sink located at the top surface ofthe base plate 101 for dissipating heat to ambient, will not besignificantly affected.

FIG. 10 is a schematic diagram for illustrating the features of aself-sealing plug structure of the heat dissipating object of onepreferred embodiment of the present invention. The numerical symbol 1300in FIG. 10 designates an enlarged view of the self-sealing plugstructure 102 as shown in FIG. 1 , in which the 102 a designates achamber with two aligned holes 102 c and 102 d at its top and bottomsides, respectively, the 102 b designates a self-sealing block enclosedand locked in the chamber 102 a, and the 102 e is for illustrating thatthe self-sealing block 102 b can become sealed by itself after a needleis inserted into then removed from it. One preferred option for aself-sealing block is a rubber block with a larger size than the chamber102 a so that the rubber block is tightly locked inside the chamber 102a after being squeezed into it. The features of the self-sealing plugstructure 103 coupled with the storage-tube 104 is similar as those ofthe 102, and is not repeated herein.

FIG. 1D and FIG. 1E are schematic diagrams for illustrating twoparticular designs for a self-sealing plug structure. The numericalsymbol 1400 in FIG. 1D designates two self-sealing plug structures 141and 142, in which the self-sealing plug structure 141 comprises a screwcup 141 a with a hole at its bottom, a self-sealing block 141 b, and apiston 141 c with a tube 141 d, wherein the self-sealing block 141 b istightly compressed inside the cup 141 a by moving the piston 141 c intothe cup 141 a along the screw threads 141 e; and the self-sealing plugstructure 142 comprises a screw cup 142 a with a hole at its bottom, aself-sealing block 142 b, and a piston 143 c, another screw cup 142 ewith a tube 142 f, and a sealing pad 142 d, wherein the self-sealingblock 142 b is tightly compressed inside the cup 142 a by moving thescrew cup 142 e upwards along the screw threads 142 g. The numericalsymbol 1500 in FIG. 1E designates two self-sealing plug structures 151and 152, in which the self-sealing plug structure 151 comprises a screwcup 151 a with a hole at its bottom, a self-sealing block 151 b, and apiston 151 c with a tube 151 d, wherein the self-sealing block 151 b istightly compressed inside the cup 151 a by pushing and fixing the piston151 c into the cup 151 a through an adhesive or solder material 151 e;and the self-sealing plug structure 152 comprises a screw cup 152 a witha hole at its bottom, a self-sealing block 152 b, and a piston 152 c,and another cup 152 e with a tube 152 f, wherein the self-sealing block152 b is tightly compressed inside the cup 152 a by pushing and fixingthe piston 152 c in the two cups 152 a and 152 e through an adhesive orsolder material 152 d.

FIG. 2 to FIG. 10 are schematic diagrams for illustrating a method toform a heat dissipating object allowing for a liquid metal TIM totransfer heat from an electronic device of another preferred embodimentof the present invention. The method mainly comprises the followingSteps 1 to 7 as illustrated by FIG. 2 for Step 1, FIG. 3 for Step 2,FIG. 4 for Step 3, FIG. 5 for Step 4, FIG. 6 and FIG. 7 for Step 5, FIG.8 and FIG. 9 for Step 6, and FIG. 10 for Step 7, which are described inthe following:

The numerical symbol 2000 in FIG. 2 is for illustrating Step 1:

-   -   1) Prepare a heat dissipating object 100 according to an        electronic device 300, wherein the heat dissipating object 100        (also referring to FIG. 1 ) includes: a base plate 101, a        sealing ring 107, a storage-tube 104 coupled with a self-sealing        plug structure 103, and another self-sealing plug structure 102,        and the electronic device 300 includes a top surface, from which        the heat of the electronic device 300 dissipates to the heat        dissipating object 100;    -   The numerical symbol 2100 in FIG. 3 is for illustrating Step 2:    -   2) Mount the heat dissipating object 100 onto the top surface of        the electronic device 300 as shown by the arrow 210 in FIG. 2 so        that the sealing ring 107 seals a peripheral region at a top        surface of the electronic device 300 and provides a sealed gap        130 as shown in FIG. 3 , in which the numerical symbols 130 b,        203 a, 205 and 206 designate air trapped in the space between        the heat dissipating object 100 and the electronic device 300;    -   The numerical symbol 2200 in FIG. 4 is for illustrating Step 3:    -   3) Prepare a liquid metal dispenser 220, which includes a liquid        metal container 221 with a piston 223, a needle tip 222, and a        moving controller as illustrated by the arrow 224 for        controlling the movement of the piston 223, and insert the        needle tip 222 through the self-sealing plug structure 102 and        into the connecting hole 105; and prepare a vacuum pump tool        230, which includes a vacuum pump 231 with a gas controller as        illustrated by the 3-way arrow 233 and a needle tip 232, and        insert the needle tip 232 through the self-sealing plug        structure 103 and into the storage-tube 104;    -   The numerical symbol 2300 in FIG. 5 is for illustrating Step 4:    -   4) Pump out the air to achieve a vacuum condition in the sealed        gap and the storage-tube as shown by the numerical symbols 130 c        and 233 c by switching the gas controller 233 of the vacuum pump        tool 230 to a vacuum condition as illustrated by the gas arrow        233 a;    -   The numerical symbol 2400 and 2500 in FIG. 6 and FIG. 7 are for        illustrating Step 5:    -   5) Inject the liquid metal from the liquid metal dispenser 220        into the sealed gap 130 and a portion of the storage-tube 104 a        by pushing the piston as shown by the arrow 240 in FIG. 6 , and        then remove the needle tip of the liquid metal dispenser from        the self-sealing plug structure 102 as shown in FIG. 7 ;    -   The numerical symbols 2600 and 2700 in FIG. 8 and FIG. 9 are for        illustrating Step 6:    -   6) Fill a gas in the remaining portion 104 b of the storage-tube        as illustrated by the gas arrow 233 b in FIG. 8 by switching the        vacuum pump tool 230 to a gas filling condition, and then remove        the needle tip of the vacuum pump tool from the self-sealing        plug structure as shown in FIG. 9 ;    -   The numerical symbol 2800 in FIG. 10 is for illustrating Step 7:    -   7) Put a drop of adhesive or glue in one or more holes of the        two self-sealing plug structures as illustrated by the numerical        symbol 281 and/or 282 in FIG. 10 .

It is noted that the Step 7 described in FIG. 10 is optional, and is forfurther sealing the self-sealing plug structures. Furthermore, the stepto put a drop of adhesive or glue in the hole of the self-sealing plugstructure as illustrated by the numerical symbol 281 and/or 282 can beperformed after the previous Step 5, i.e., put a drop of adhesive orglue in the hole after right after removing the needle tip of the liquidmetal dispenser from the self-sealing plug structure 102 as shown inFIG. 7 .

FIG. 11 is a schematic diagram for illustrating that the electronicdevice is particularly a flip chip package of one preferred embodimentof the present invention. The numerical symbol 3000 in FIG. 11designates a heat dissipating object allowing for a liquid metal TIM totransfer heat from a flip chip package of one preferred embodiment ofthe present invention, in which the numerical symbol 310 designates aflip chip package, including a flip chip 301 and a substrate 302, the303 designates that the sealing ring 107 directly seals a peripheraledge region at a top surface of the flip chip 301 so as to provide asealed gap 130 between a portion of the bottom surface of the base plate101 and a portion of the top surface of the flip chip 301.

FIG. 12 is a schematic diagram for illustrating another design for thesealing ring for the case that the electronic device is particularly aflip chip package of one embodiment of the present invention. Thenumerical symbol 3100 in FIG. 12 designates a heat dissipating objectallowing for a liquid metal TIM to transfer heat from a flip chippackage of one preferred embodiment of the present invention, in whichthe numerical symbol 107A designates a sealing ring, which seals aperipheral edge region at a top surface of the flip chip 301 and aregion of the substrate surrounding the flip chip so as to provide asafer sealing and also mechanically protect the edge region of the flipchip, and the numerical symbol 100A designates a heat dissipating objecthaving the sealing ring 107A.

FIG. 13 is a schematic diagram for illustrating that the electronicdevice is particularly a lidded flip chip package of another preferredembodiment of the present invention. The numerical symbol 4000 in FIG.13 designates a heat dissipating object allowing for a liquid metal TIMto transfer heat from a lidded flip chip package of one preferredembodiment of the present invention, in which the numerical symbol 320designates a lidded flip chip package, comprising: a lid including a toppiece 331 and a foot 332 and a flip chip package including a flip chip320 and a substrate 321, wherein the lid is attached onto the flip chippackage through an adhesive 341, and a thermal interface material (TIM)342. The heat generated by the flip chip will mainly transfer to the lidthrough the TIM 342, and then transfer to the dissipating object 100through the liquid metal TIM 130 a. The numerical symbol 307 in FIG. 13designates that the sealing ring 107 seals a peripheral region at a topsurface of the top piece 331 of the lid so as to provide a sealed gap130 between a portion of the bottom surface of the base plate 101 and aportion of the top surface of the top piece 331. It is noted that thesealing ring 107 can be flexibly designed for the case of a lidded flipchip package by following a basic guidance, i.e., a peripheral region ata top surface of the top piece 331 sealed by the sealing ring 107 shouldbe outside the region of the flip chip. The numerical symbol 307 in FIG.13 also designates an optional ring-form of notch at the top surface ofthe top piece 331 so that the sealing ring can be placed inside it.

FIG. 14 is a schematic diagram for further illustrating a heatdissipating object allowing for a liquid metal TIM to transfer heat froma lidded flip chip package of one preferred embodiment of the presentinvention. The numerical symbol 5000 in FIG. 14 designates a heat sinkas a heat dissipating object, in which the numerical symbol 1008designates a heat sink coupled with two self-sealing plug structures 102and 103, the self-sealing plug structure 102 is mounted in the baseplate of the heat sink 1008, and the self-sealing plug structure 103 ismounted at the outer end of the storage-tube, the lidded flip chippackage 320B is mounted on a PCB (printed circuit board) 510, the heatsink 1008 is mounted over the lidded flip chip package 320B through afixture 500 between the heat sink 320B and the PCB 510 so that apressure can be applied on the sealing ring for it to be clamped betweenthe heat sink and the lid to form a sealed gap 130. It is noted that theheat dissipating object in the present invention can particularly be avapor chamber or a cold plate, which can be similarly coupled with twoself-sealing plug structures, a sealing ring and a storage-tube to allowfor a liquid metal TIM to efficiently transfer heat from an electronicdevice, like a lidded flip chip package.

FIG. 15 is a schematic diagram for illustrating a heat dissipatingobject coupled with a folding-form of storage-tube and a self-sealingplug structure with a connecting tube of another preferred embodiment ofthe present invention. The numerical symbol 6000 in FIG. 15 designates aheat dissipating object, in which the numerical symbol 603 designates afolding-form of storage-tube 603 b coupled with a self-sealing plugstructure 603 a at its outer end, and the 602 designates a self-sealingplug structure 602 a with a connecting tube 602 b.

It is noted that the self-sealing plug structure 602/102 is forinjecting a liquid metal into the sealed gap and the storage-tubeaccording to the method described in conjunction with the drawings inFIG. 2 to FIG. 10 . However, the usage of the self-sealing plugstructure 602/102 is not limited for this purpose. It can also be usedfor venting air while injecting a liquid metal from the self-sealingplug structure 603 a via the storage-tube 603 b into the sealed gapwithout using a vacuum pump tool, which is simply described in FIG. 16below.

FIG. 16 is a schematic diagram for illustrating heat dissipating objectcoupled with a storage-tube with a self-sealing plug structure and aplurality of self-sealing plug structures for venting air of anotherpreferred embodiment of the present invention. The numerical symbol 7000in FIG. 16 designates a heat dissipating object allowing for a liquidmetal TIM to transfer heat from a lidded flip chip package, in which thenumerical symbol 703 designates a storage-tube 703 a coupled with aself-sealing plug structure 703 b at its outer end, the 702 a and 702 bdesignate a plurality of self-sealing plug structures mounted at thebase plate of the heat dissipating object, the 713 designates a needlefor injecting a liquid metal into the storage-tube 703 a and into thesealed gap, and the 712 a and 712 b designate needles corresponding tothe self-sealing plug structures 702 a and 702 b for venting air duringinjecting the liquid metal into the sealed gap. It is noted that aneedle 712 a and/or 712 b is removed once the liquid metal has reachedit while injecting the liquid metal into the sealed gap. It is alsonoted that the heat dissipating object is relatively convenient forpersonal use when a vacuum pump tool is not available.

The spirit and scope of the present invention is to mount a self-sealingplug structure at the outer end of a storage-tube and another one ormore self-sealing plug structures at the base plate of a heatdissipating object so that a liquid metal can be easily and safelyfilled into the sealed gap, and then isolated from the atmosphere by theself-sealing plug structures to avoid its oxidization. In an electronicsystem with a semiconductor chip as a heat-generating object, aheat-dissipating-object usually includes a heat sink, a cold plate, avapor chamber, or a combination of these particular heat dissipatingobjects, like a heat sink coupled with a vapor chamber or vapor tubes.These heat-dissipating objects commonly include a base plate having atop and a bottom surface, and the bottom surface of the heat-dissipatingobjects contacts a top surface of the electronic device through a TIMfor transferring heat from the electronic device to the heat dissipatingobjects, which then transmits heat to the ambient. According to thespirit and scope of the present invention, a heat-dissipating-objectwith a storage-tube as a reservoir and one or more self-sealing plugstructures can be flexibly designed.

Although the present invention is described in some details forillustrative purpose with reference to the specific embodiments anddrawings, it is apparent that many other modifications and variationsmay be made without departing from the spirit and scope of the presentinvention.

What is claimed is:
 1. A heat-dissipating object allowing for a thermalinterface material (TIM) with fluidity to transfer heat from anelectronic device, comprising: a base plate having a top surface and abottom surface and one or more self-sealing plug structures, a sealingring, a liquid-storage tube integrated with a self-sealing plugstructure, wherein the sealing ring is mounted at the bottom surface ofthe base plate, directly sealing a peripheral region at a top surface ofthe electronic device to provide a sealed gap between a portion of thebottom surface of the base plate and a portion of the top surface of theelectronic device; wherein each self-sealing plug structure includes achamber with a self-sealing block mounted inside; wherein theliquid-storage tube has two ends, one end is connected to the sealed gapthrough a connecting hole, and another end is integrated with theself-sealing plug structures; wherein the one or more self-sealing plugstructures of the base plate are positioned at the top surface of thebase plate and connected to the sealed gap through one or moreconnecting holes; and wherein the sealed gap is entirely filled with athermal interface material with fluidity, a portion of theliquid-storage tube is filled with the same thermal interface material,and the remaining portion of the liquid-storage tube is filled with agas.
 2. The heat-dissipating object of claim 1, wherein theheat-dissipating object has a ring-form of notch at its bottom surface,in which the seal ring is mounted.
 3. The heat-dissipating object ofclaim 1, wherein the sealing ring is compressed between the bottomsurface of the base plate and the top surface of the electronic device.4. The heat-dissipating object of claim 1, wherein the self-sealingblock is a rubber block.
 5. The heat-dissipating object of claim 4,wherein the rubber block is bigger than the chamber, and is compressedinside the chamber.
 6. The heat-dissipating object of claim 1, whereinthe chamber of the self-sealing plug structure consists of two cups. 7.The heat-dissipating object of claim 6, wherein the two cups are joinedtogether through an adhesive or solder material, or through a screwconnection.
 8. The heat-dissipating object of claim 6, wherein the twocups are joined together through an adhesive or solder material, orthrough a screw connection, and a piston is also enclosed inside the twocups in addition to the self-sealing block.
 9. The heat-dissipatingobject of claim 1, wherein the chamber of the self-sealing plugstructure consists of a cup with a piston.
 10. The heat-dissipatingobject of claim 1, wherein the chamber of each self-sealing plugstructure includes two holes, one at its top side and another at itsbottom side.
 11. The heat-dissipating object of claim 10, wherein a dropof adhesive or glue is placed in one or more holes at the top sides ofone or more chambers.
 12. The heat-dissipating object of claim 1,wherein the self-sealing plug structures of the base plate includes aconnecting tube, from which the self-sealing plug structure is connectedto the sealed gap.
 13. The heat-dissipating object of claim 1, whereinthe liquid-storage tube is a folding-form of tube.
 14. Theheat-dissipating object of claim 1, wherein the heat-dissipating objectis a heat sink, a cold plate, or a vapor chamber.
 15. Theheat-dissipating object of claim 1, wherein the thermal interfacematerial with fluidity is a liquid metal, including gallium and galliumalloy.
 16. The heat-dissipating object of claim 1, wherein theelectronic device is a flip chip package, including a flip chip attachedon a substrate, the flip chip has a top surface, a bottom surface andfour sides, the top surface of the flip chip is the top surface of theelectronic device, and the seal ring directly seals a peripheral edgeregion at the top surface of the flip chip.
 17. The heat-dissipatingobject of claim 16, wherein the seal ring also seals the sides of theflip chip and/or a portion of the top surface of the substratesurrounding the sides of the flip chip.
 18. The heat-dissipating objectof claim 1, wherein the electronic device is a lidded flip chip package,including a flip chip package covered with a lid, the top surface of thelid is the top surface of the electronic device, and the seal ringdirectly seals a peripheral region at the top surface of the lid. 19.The heat-dissipating object of claim 18, wherein the lid includes aring-form of notch at a peripheral region of a top surface of the lid,and the seal ring is placed in the ring-form of notch.
 20. Theheat-dissipating object of claim 1, wherein the thermal interfacematerial with fluidity is formed by a method, which mainly comprises thefollowing steps: 1) Mount a heat dissipating object onto an electronicdevice; 2) Insert a needle of a vacuum pump tool through theself-sealing plug structure integrated with the liquid-storage tube, andinsert a needle of a liquid dispenser through the self-sealing plugstructure integrated with the base plate; 3) Pump out the air in thespace between the heat-dissipating object and the electronic device,including that in the sealed gap and the liquid-storage tube byswitching the vacuum pump tool to its vacuum condition; 4) Inject thethermal interface material with fluidity into the sealed gap and aportion of the storage tunnel using the liquid dispenser, and thenremove the needle of the liquid dispenser; 5) Fill a gas into theremaining portion of the storage tunnel by switching the vacuum pumptool to its gas filling condition, and then remove the needle of thevacuum pump tool.